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Posté le: Mar 12 Déc - 08:04 (2017) Sujet du message: Soldering SARA-U2 without reflow oven
I need to assembly the first prototype of my board for SARA-U2. I need to do it myself, as this is just 1 unit, so its not worth sending it to the fab. I have ordered a small 140 x 140 mm stencil just to place the soldering paste on the pads (human stencil printer). Then I plan to place the chip on the solder paste with hand (human pick and place machine) and solder it with hot air gun (human reflow oven). I find 2 problems ahead:
It will be hard to place the device precisely with hand, mine are a bit shaky.
I have noticed that there text on the device is a piece of paper glued to the aluminum chassis. I am afraid that after I heat it up with hot air, the paper might burn.
Did anyone already try this approach and has some hints he could share? I would appreciate all help.
I didn't find the right solution from the Internet.